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1

Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon

Sukumaran, Vijay, Kumar, Gokul, Ramachandran, Koushik, Suzuki, Yuya, Demir, Kaya, Sato, Yoichiro, Seki, Toshitake, Sundaram, Venky, Tummala, R. R.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2014

Language:

english

File:

PDF, 3.19 MB

english, 2014

2

Conductive Anodic Filament Reliability of Small and Fine-Pitch Through Vias in Halogen-Free Organic Packaging Substrate

Ramachandran, Koushik, Liu, Fuhan, Sundaram, Venky, Tummala, Rao

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 605 KB

english, 2013

3

Investigation of copper plated-through-holes in glass fiber reinforced epoxy substrates using AC impedance spectroscopy

Ramachandran, Koushik, Pruyn, Timothy L., Huang, Timothy, Wang, Yushu, Singh, Preet M., Jud Ready, W., Gerhardt, Rosario A., Sundaram, Venky, Tummala, Rao

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2015

Language:

english

File:

PDF, 4.08 MB

english, 2015

4

Insulation reliability of fine-pitch through-vias in glass fiber reinforced halogen-free epoxy substrates

Ramachandran, Koushik, Ready, W. Jud, Raj, P. Markondeya, Sundaram, Venky, Tummala, Rao

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2014

Language:

english

File:

PDF, 7.12 MB

english, 2014

5

Multi-Variate Data Fusion Technique for Reducing Sensor Errors in Intelligent Transportation Systems

Manogaran, Gunasekaran, Balasubramanian, Venki, Rawal, Bharat S., Saravanan, Vijayalakshmi, Montenegro-Marin, Carlos Enrique, Ramachandran, Varatharajan, Kumar, Priyan Malarvizhi

Journal:

IEEE Sensors Journal

Year:

2020

File:

PDF, 1.41 MB

2020

6

Conductive Anodic Filament Failures in Fine-Pitch Through-Via Interconnections in Organic Package Substrates

Koushik Ramachandran, Fuhan Liu, P. Markondeya Raj, Venky Sundaram, Rao Tummala

Journal:

Journal of Electronic Materials

Year:

2013

Language:

english

File:

PDF, 666 KB

english, 2013

7

Accelerating eye movement research via accurate and affordable smartphone eye tracking

Valliappan, Nachiappan, Dai, Na, Steinberg, Ethan, He, Junfeng, Rogers, Kantwon, Ramachandran, Venky, Xu, Pingmei, Shojaeizadeh, Mina, Guo, Li, Kohlhoff, Kai, Navalpakkam, Vidhya

Journal:

Nature Communications

Year:

2020

File:

PDF, 5.01 MB

2020

8

[ACM Press the 2006 international symposium - San Jose, California, USA (2006.04.09-2006.04.12)] Proceedings of the 2006 international symposium on Physical design - ISPD '06 - Solving hard instances of floorplacement

Ng, Aaron N., Markov, Igor L., Aggarwal, Rajat, Ramachandran, Venky

Year:

2006

Language:

english

File:

PDF, 2.12 MB

english, 2006

9

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Chip-last fan-out package with embedded power ICs in ultra-thin laminates

Kumbhat, Nitesh, Ramachandran, Koushik, Liu, Fuhan, Wagner, Brent, Sundaram, Venky, Tummala, Rao

Year:

2012

Language:

english

File:

PDF, 1.80 MB

english, 2012

10

Solving modern mixed-size placement instances

Jarrod A. Roy, Aaron N. Ng, Rajat Aggarwal, Venky Ramachandran, Igor L. Markov

Journal:

Integration, the VLSI Journal

Year:

2009

Language:

english

File:

PDF, 3.42 MB

english, 2009

11

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Reliability of fine pitch halogen-free organic substrates for green electronics

Ramachandran, Koushik, Liu, Fuhan, Kumbhat, Nitesh, Wilson, Mark, Sundaram, Venky, Tummala, Rao

Year:

2011

Language:

english

File:

PDF, 1.63 MB

english, 2011

12

[ACM Press the 2012 ACM international symposium - Napa, California, USA (2012.03.25-2012.03.28)] Proceedings of the 2012 ACM international symposium on International Symposium on Physical Design - ISPD '12 - Construction of minimal functional skew clock trees

Ramachandran, Venky

Year:

2012

Language:

english

File:

PDF, 354 KB

english, 2012

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